GSoC 2010

The RepRap Team is considering the option of participating in Google Summer of Code (GSoC) 2010 as a means of increasing our development efforts.

With the development and rapid evolution of Mendel software, firmware and electrical areas of the RepRap project may be being out paced by hardware development. Current hardware designs have their limitations as well and certainly in the area of tool heads there are many directions we could take. What do you think? Got an idea that you haven't had the time to get off the ground? Add it to the list!

Software

Students interested in working on a software project should be familiar with the language specific to that project however generally a knowledge of Java and C++ will help in understanding existing code.

Ideas

• Implement a generic low-level C/C++ software driver that can serve as a tool for existing and future RepRap softwares. Requirements:
  • OS-independent standardized API - POSIX/Windows - multiple implementations may be required. API should be highly documented and finalized.
  • High stability - end product should be at a maximum as buggy as the best existing drivers - otherwise it will not replace existing per-application drivers
  • Multi-Firmware - firmware independence is essential to the longevity and usefulness of the proposed driver level
• Multi-Use - Python back-end to allow ease of functional expansion; rather than re-write code to do something, make a plug-in
• CAD/CAM tool set
  • Ability to have skienforge drive more than one color extruder from a single 3D model
  • Ability to have skienforge drive a second extruder to laminate fiberglass into a solid plastic build. Should be able to either define a fiberglass density and have it automatically alternate plastic and fiberglass, and to lay fiberglass down in different directions. Also ability to specify exactly where and how much fiberglass is added so that reinforced beams will have thick fiberglass tensile bundle along top and bottom, and also reinforce vertical and cross pieces.
  • Ability to have skeinforge select one of several orifices sizes on a single extruder, and to change the spacing and layer thickness to allow for the faster build-up of coarse, bulk fill setting on one hand, and fine detail with slow fill rate on the other. It should also build up the edges first for several layers, then medium fill near the edges and repeat until edges are built up enough to hold bulk fill stream.
  • Improve open source 3D modeling software to allow defining fiberglass reinforcing, and selecting different materials in single model.
  • Design rule checker for either 3D models, STL files, or G-code files to check for hard to manufacture spots like large unsupported spans not on the bed, details too small to resolve, objects too close to keep separate.
  • STL pre-processor that will estimate thermal shrinkage and make corners and bottom edge protrude enough to shrink to correct shape.
• 3D scan software to take data from a spinning LED/laser and an offset CCD camera to produce a 3d top surface. Software to combine several different 3D scans of one item to get a more accurate model to replicate the part. A auto-replicate mode.

Firmware

Students interested in working on a firmware project should be experienced in C/C++ (the languages used in the RepRap firmwares). Knowledge of GCode, RS485, binary communication and embedded programming may also be helpful depending on the project.

Ideas

• "The Network is the RepRap" - develop a network compatible firmware upgrade for the existing RepRap motherboard as well as software driver and the relevant electronics.
  • Implement the RepRap as a CANBUS device so that it can interact with external automated devices.
  • Implement the RepRap as a ethernet enabled device so that it can cheaply network with consumer off the shelf routers and switches. This will also speed up the downloading of fabrication files, allowing the host computer to disconnect or do other things.
• Implement open source versions of the libraries used in the RapMan electronics (v3 and v3.1) so that a complete firmware package can be distributed and innovated upon by the community.
• Additional challenges such as implementing an interactive serial over USB (or ethernet).
• Add a SD or other flash card reader to the mother board to store one or more projects so that it can work off line. Modify firmware to support storing and retrieving files, models, etc. On board LCD display to allow selecting from the list of stored parts.

Electronics

Electronics may play into GSoC since firmware modifications are often hardware related. A working knowledge of ECAD such as Eagle is recommended here.

Ideas

• Work with Makerbot to finish the RepRap Gen 4 Electronics
• Make simplest electronics design for at least PCB be printed by reprap
• Move towards easier to source and lower cost chips, instead of eclectic ones

Hardware

Again due to their relation to electronics and thereby software mechanical design skills and MCAD is a part of the interdisciplinary skill set which could help GSoC 2010 student applicants. OpenSCAD and Solid Edge specifically are commonly used within the RepRap community and core team.

Ideas

• Port the tool change system to Mendel and integrate it with existing print heads.
• Work on making a printable drive/support system, using some form of a Sarrus linkage
• Heated Bed - it's the most important add on to RepRap however everyone is still doing his own version. We need to develop a cheap, acessible and simple Heated Bed.

Documentation

• Create an interactive guide that help someone to build a RepRap so that the entry level of building one is lower.

External Links

• Google Summer of Code