The CRAMPS board is a mixed surface-mount and through-hole design. There are a small number of fine-pitch components (the resistor networks and FET bus level translator). These parts are challenging but possible to solder by hand. All other parts are large pitch or through-hole, and are relatively easy to hand solder.
The CRAMPS board is designed to handle power levels capable of causing a fire. Be very careful with the initial board checkout, ideally using a power supply protected from short circuit and overload. Never operate your board unattended, and make sure all connected parts subject to heating (including the wires and connectors!) are far away from any potentially combustible material. Always use the proper fuses, and insure your smoke detector is working properly.
You must have: Solder iron, solder wire, good tweezers You really need: Solder wick, solder sucker, flux pen Optional methods use: Solder paste, hot plate or oven
Soldering the CRAMPS board includes both surface mount and through hole soldering.
The surface mount can be done a few ways. To hand solder, start by putting a small amount of solder on one pad. If you have flux, coat the soldered pad. Use the tweezers to hold the component down in position and heat the solder to tack the component into place (make sure the entire solder blob flows so you don't get a cold solder joint). Then solder the other pads. Also popular is using solder paste for pad by pad soldering, Oven Reflow (need link), and HotplateReflowTechnique
Solder the SMT components first, starting with the fine pitch parts then working through the parts from shortest to tallest. Then solder the through-hole parts on top of the board. Finally solder the pin headers on the bottom of the board.
10K Resistor Network
RP1 RP2 RP3 RP801 RP802
These can be placed in any orientation.
74CBTLD3861 - FET Bus Level Translator
Place with the dot on pin 1 aligned with the silk-screen dot on the PCB.